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MOP012 |
Design Status of the Electron-Ion Collider Beam Instrumentation | ||||
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Funding: Work supported by Brookhaven Science Associates, LLC under Contract No. DE-SC0012704 with the U.S. Department of Energy The Electron Ion Collider (EIC) is being built at Brookhaven National Laboratory (BNL). Early preliminary design phase efforts are underway. In addition to upgrading the existing RHIC instrumentation for the EIC hadron storage ring, new electron accelerator subsystems that include a 400 MeV Linac, rapid-cycling synchrotron, electron storage ring, and a strong hadron cooling facility will have all new instrumentation systems. The scope of the instrumentation includes devices to measure beam position, loss, current, charge, tune, transverse and longitudinal profiles, emittance, and crabbing angles. A description of the planned instruments and the present design status will be presented. |
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WE2C03 | Beam Instrumentation Hardware Architecture for Upgrades at the BNL Collider-Accelerator Complex and the Future Electron Ion Collider | 308 | |||
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Funding: Work supported by Brookhaven Science Associates, LLC under Contract No. DE-SC0012704 with the U.S. Department of Energy. Many beam instrumentation systems at Brookhaven National Laboratory¿s Collider-Accelerator complex are over 20 years old and in need of upgrading due to obsolete components, old technology and the desire to provide improved performance and enhanced capabilities. In addition, many new beam instrumentation systems will be developed for the future Electron Ion Collider (EIC) that will be housed in the existing Relativistic Heavy Ion Collider (RHIC) tunnel. A new BNL designed custom hardware architecture is planned for both upgrades in the existing facility and new systems for the EIC. A general-purpose carrier board based on the Xilinx Zynq Ultrascale+ System-on-Chip (SoC) will interface with a family of application specific daughter cards to satisfy the requirements for each system. This paper will present the general architecture that is planned, as well as details for some of the application specific daughter cards that will be developed. |
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Slides WE2C03 [6.911 MB] | |||||
DOI • | reference for this paper ※ doi:10.18429/JACoW-IBIC2023-WE2C03 | ||||
About • | Received ※ 09 September 2023 — Revised ※ 11 September 2023 — Accepted ※ 13 September 2023 — Issue date ※ 27 September 2023 | ||||
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